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LM1085IT-ADJ/NOPB bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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LM1085IT-ADJ/NOPB bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 29 page LM1085 SNVS038H – JULY 1999 – REVISED JANUARY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Maximum Input to Output Voltage Differential LM1085-ADJ 29 V LM1085-12 18 V LM1085-3.3 27 V LM1085-5.0 25 V Power Dissipation (3) Internally Limited V Junction Temperature (TJ) (4) 150 °C Lead Temperature 260, to 10 sec °C Storage temperature range, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery. (4) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations in the Application Notes. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Junction Temperature (TJ) (1) −40 125 °C (1) The maximum power dissipation is a function of TJ(max) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations in the Application Notes. 6.4 Thermal Information LM1085 THERMAL METRIC(1) KTT NDE UNIT 3 PINS 3 PINS RθJA Junction-to-ambient thermal resistance 40.6 22.8 RθJC(top) Junction-to-case (top) thermal resistance 43.0 15.6 RθJB Junction-to-board thermal resistance 23.1 4.2 °C/W ψJT Junction-to-top characterization parameter 9.9 2.2 ψJB Junction-to-board characterization parameter 22.1 4.2 RθJC(bot) Junction-to-case (bottom) thermal resistance 0.7 0.7 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: LM1085 |
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