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LM317L
SLCS144E – JULY 2004 – REVISED OCTOBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating temperature range (unless otherwise noted)
MIN
MAX
UNIT
Vl – VO
Input-to-output differential voltage
35
V
TJ
Operating virtual-junction temperature
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
0
3000
pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification
0
2000
JESD22-C101, all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
VO
Output voltage
1.25
32
V
VI – VO
Input-to-output voltage differential
2.5
32
V
IO
Output current
2.5
100
mA
LM317LC
0
125
TJ
Operating virtual-junction temperature
°C
LM317LI
–40
125
7.4 Thermal Information
LM317L
THERMAL METRIC(1)
UNIT
D
LP
PK
PW
8 PINS
3 PINS
3 PINS
8 PINS
R
θJA Junction-to-ambient thermal resistance
97.1
139.5
51.5
149.4
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
4
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Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: LM317L


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