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SN74AHC245-Q1 bảng dữ liệu(PDF) 5 Page - Texas Instruments |
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SN74AHC245-Q1 bảng dữ liệu(HTML) 5 Page - Texas Instruments |
5 / 32 page SN54AHC245, SN74AHC245 www.ti.com SCLS230J – OCTOBER 1995 – REVISED JULY 2014 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) SN54AHC245 SN74AHC245 UNIT MIN MAX MIN MAX VCC Supply voltage 2 5.5 2 5.5 V VCC = 2 V 1.5 1.5 VIH High-level input voltage VCC = 3 V 2.1 2.1 V VCC = 5.5 V 3.85 3.85 VCC = 2 V 0.5 0.5 VIL Low-level input voltage VCC = 3 V 0.9 0.9 V VCC = 5.5 V 1.65 1.65 VI Input voltage OE or DIR 0 5.5 0 5.5 V VO Output voltage A or B 0 VCC 0 VCC V VCC = 2 V –50 –50 µA IOH High-level output current VCC = 3.3 V ± 0.3 V –4 –4 mA VCC = 5 V ± 0.5 V –8 –8 VCC = 2 V 50 50 µA IOL Low-level output current VCC = 3.3 V ± 0.3 V 4 4 mA VCC = 5 V ± 0.5 V 8 8 VCC = 3.3 V ± 0.3 V 100 100 ∆t/∆v Input transition rise or fall rate ns/V VCC = 5 V ± 0.5 V 20 20 TA Operating free-air temperature –55 125 –40 125 °C (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 7.4 Thermal Information DB DGV DW N NS PW RGY THERMAL METRIC(1) UNIT 20 PINS RθJA Junction-to-ambient thermal resistance 96.0 116.1 79.8 51.5 77.1 102.8 35.1 RθJC(top) Junction-to-case (top) thermal resistance 57.7 31.3 45.8 38.2 43.6 36.8 43.3 RθJB Junction-to-board thermal resistance 51.2 57.6 47.4 32.4 44.6 53.8 12.9 ψJT Junction-to-top characterization parameter 19.4 1.0 18.5 24.6 17.2 2.5 0.9 °C/W Junction-to-board characterization ψJB 50.8 56.9 47.0 32.3 44.2 53.3 12.9 parameter Junction-to-case (bottom) thermal RθJC(bot) n/a n/a n/a n/a n/a n/a 7.9 resistance (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). Copyright © 1995–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: SN54AHC245 SN74AHC245 |
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