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LM2574HVM-3.3/NOPB bảng dữ liệu(PDF) 2 Page - Texas Instruments |
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LM2574HVM-3.3/NOPB bảng dữ liệu(HTML) 2 Page - Texas Instruments |
2 / 38 page 2 LM2574, LM2574HV SNVS104D – JUNE 1999 – REVISED APRIL 2016 www.ti.com Product Folder Links: LM2574 LM2574HV Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions ....................... 4 6.4 Thermal Information .................................................. 4 6.5 Electrical Characteristics for All Output Voltage Versions ..................................................................... 5 6.6 Electrical Characteristics – 3.3-V Version................. 5 6.7 Electrical Characteristics – 5-V Version.................... 6 6.8 Electrical Characteristics – 12-V Version.................. 6 6.9 Electrical Characteristics – 15-V Version.................. 6 6.10 Electrical Characteristics – Adjustable Version....... 7 6.11 Typical Characteristics ............................................ 8 7 Detailed Description ............................................ 11 7.1 Overview ................................................................. 11 7.2 Functional Block Diagram ....................................... 11 7.3 Feature Description................................................. 11 7.4 Device Functional Modes........................................ 13 8 Application and Implementation ........................ 14 8.1 Application Information............................................ 14 8.2 Typical Applications ................................................ 19 9 Power Supply Recommendations ...................... 25 10 Layout................................................................... 25 10.1 Layout Guidelines ................................................. 25 10.2 Layout Example .................................................... 26 10.3 Grounding ............................................................. 26 10.4 Thermal Considerations ........................................ 26 11 Device and Documentation Support ................. 28 11.1 Device Support...................................................... 28 11.2 Documentation Support ........................................ 29 11.3 Community Resources.......................................... 29 11.4 Trademarks ........................................................... 30 11.5 Electrostatic Discharge Caution ............................ 30 11.6 Glossary ................................................................ 30 12 Mechanical, Packaging, and Orderable Information ........................................................... 30 4 Revision History Changes from Revision C (April 2013) to Revision D Page • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ..................................... 1 • Changed RθJA value in SOIC column to 77.1 ........................................................................................................................ 4 • Split test conditions row of the Electrical Characteristics table to include TJ = 25°C and TJ < 25°C MIN, TYP, and MAX values............................................................................................................................................................................. 5 • Split test conditions in IL row to rearrange the MIN, TYP, and MAX values ......................................................................... 5 Changes from Revision B (November 2004) to Revision C Page • Changed layout of National Data Sheet to TI format ............................................................................................................. 1 |
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