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LF198JAN
www.ti.com
SNOSAJ2A – FEBRUARY 2005 – REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
Supply Voltage
±18V
Power Dissipation (Package Limitation)(2)
500 mW
Operating Ambient Temperature Range
−55°C ≤TA ≤ +125°C
Storage Temperature Range
−65°C to +150°C
Maximum Junction Temperature (TJmax)
+150°C
Input Voltage
Equal to Supply Voltage
Logic To Logic Reference Differential Voltage(3)
+7V,
−30V
Output Short Circuit Duration
Indefinite
Hold Capacitor Short Circuit Duration
10 sec
Lead Temperature (Soldering, 10 sec.)
300°C
TO-99 (Still Air @ 0.5W)
160°C/W
θJA
Thermal Resistance
TO-99 (500 LF/Min Air Flow @ 0.5W)
84°C/W
θJC
TO-99
48°C/W
ESD Tolerance(4)
500V
(1)
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions
(2)
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature,
TA. The maximum allowable power dissipation at any temperature is PD = (TJMAX − TA)/θJA, or the number given in the Absolute
Maximum Ratings, whichever is lower. .
(3)
Although the differential voltage may not exceed the limits given, the common-mode voltage on the logic pins may be equal to the
supply voltages without causing damage to the circuit. For proper logic operation, however, one of the logic pins must always be at least
2V below the positive supply and 3V above the negative supply.
(4)
Human body model, 100pF discharged through 1.5K
Quality Conformance Inspection
Mil-Std-883, Method 5005 — Group A
Subgroup
Description
Temperature (°C)
1
Static tests at
+25°C
2
Static tests at
+125°C
3
Static tests at
−55°C
4
Dynamic tests at
+25°C
5
Dynamic tests at
+125°C
6
Dynamic tests at
−55°C
7
Functional tests at
+25°C
8A
Functional tests at
+125°C
8B
Functional tests at
−55°C
9
Switching tests at
+25°C
10
Switching tests at
+125°C
11
Switching tests at
−55°C
Copyright © 2005–2013, Texas Instruments Incorporated
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