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ADS1204IRHBR bảng dữ liệu(PDF) 2 Page - Texas Instruments |
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ADS1204IRHBR bảng dữ liệu(HTML) 2 Page - Texas Instruments |
2 / 21 page ADS1204 SBAS301A − OCTOBER 2003 − REVISED JUNE 2004 www.ti.com 2 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION PRODUCT MAXIMUM INTEGRAL LINEARITY ERROR (LSB) MAXIMUM GAIN ERROR (%) PACKAGE- LEAD PACKAGE DESIGNATOR(1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ADS1204 ±3 ±0.5 QFN-32 RHB −40 °C to +85°C ADS1204I ADS1204IRHBT Tape and Reel, 250 ADS1204 ±3 ±0.5 QFN-32 RHB −40 °C to +85°C ADS1204I ADS1204IRHBR Tape and Reel, 3000 (1) For the most current specification and package information, refer to our web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) ADS1204 UNIT Supply Voltage, AVDD to AGND −0.3 to 6 V Supply Voltage, BVDD to BGND −0.3 to 6 V Analog Input Voltage with Respect to AGND AGND − 0.3 to AVDD + 0.3 V Reference Input Voltage with Respect to AGND AGND − 0.3 to AVDD + 0.3 V Digital Input Voltage with Respect to BGND BGND − 0.3 to BVDD + 0.3 V Ground Voltage Difference, AGND to BGND ±0.3 V Voltage Differences, BVDD to AGND −0.3 to 6 V Input Current to Any Pin Except Supply ±10 mA Power Dissipation See Dissipation Rating Table Operating Virtual Junction Temperature Range, TJ −40 to +150 °C Operating Free-Air Temperature Range, TA −40 to +85 °C Storage Temperature Range, TSTG −65 to +150 °C Lead Temperature (1.6mm or 1/16 ″ from case for 10s) 260 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS PARAMETER MIN NOM MAX UNIT Supply Voltage, AVDD to AGND 4.75 5 5.25 V Supply Voltage, BVDD to BGND Low-Voltage Levels 2.7 3.6 V Supply Voltage, BVDD to BGND 5V Logic Levels 4.5 5 5.5 V Reference Input Voltage 0.5 2.5 2.6 V Operating Common-Mode Signal 0 AVDD V Analog Inputs +IN − (−IN) 0 ±REFIN V External Clock(1) 16 20 24 MHz Operating Junction Temperature Range, TJ −40 105 °C (1) With reduced accuracy, clock can go from 1MHz up to 32MHz; see Typical Characteristic curves. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C(1) TA = 70°C POWER RATING TA = 85°C POWER RATING QFN-32 (5x5) 2725mW 27.25mW/ °C 1499mW 1090mW (1) This is the inverse of the traditional junction-to-ambient thermal resistance (RqJA). Thermal resistances are not production tested and are for informational purposes only. |
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