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ABSOLUTE MAXIMUM RATINGS

(1)

DAC8814

SBAS338D – JANUARY 2005 – REVISED SEPTEMBER 2006

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

MINIMUM

RELATIVE

DIFFERENTIAL

SPECIFIED

TRANSPORT

ACCURACY

NONLINEARITY

TEMPERATURE

PACKAGE-

PACKAGE

ORDERING

MEDIA,

PRODUCT

(LSB)

(LSB)

RANGE

LEAD

DESIGNATOR

NUMBER

QUANTITY

DAC8814ICDBT

Tape and Reel, 250

DAC8814C

±1

±1

– 40

°C to +85°C

SSOP-28

DB

DAC8814ICDBR

Tape and Reel, 2500

DAC8814IBDBT

Tape and Reel, 250

DAC8814B

±4

±1.5

–40

°C to +85°C

SSOP-28

DB

DAC8814IBDBR

Tape and Reel, 2500

(1)

For the most current specifications and package information, see the Package Option Addendum located at the end of this document, or

see the TI website at www.ti.com.

DAC8814

UNIT

–0.3 to +8

V

–18 to +18

V

Logic inputs and output to GND

–0.3 to +8

V

V

–0.3 to +0.3

V

Input current to any pin except supplies

±50

mA

Package power dissipation

W

Thermal resistance,

θ

JA

28-Lead shrink surface-mount (RS-28)

100

°C/W

150

°C

Operating temperature range, Model A

–40 to +85

°C

Storage temperature range

–65 to +150

°C

ESD rating, HBM

3000

V

ESD rating, CDM

500

V

(1)

Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only;

functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification

is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.

2

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