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DAC8801IDGKR bảng dữ liệu(PDF) 2 Page - Texas Instruments |
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DAC8801IDGKR bảng dữ liệu(HTML) 2 Page - Texas Instruments |
2 / 22 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) DAC8801 SLAS403B – NOVEMBER 2004 – REVISED FEBRUARY 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) MINIMUM RELATIVE DIFFERENTIAL SPECIFIED TRANSPORT ACCURACY NONLINEARITY PACKAGE- PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA, PRODUCT (LSB) (LSB) LEAD DESIGNATOR RANGE MARKING NUMBER QUANTITY Tape and Reel, DAC8801 ±1 ±0.5 MSOP-8 DGK -40 °C to 85°C F01 DAC8801IDGKT 250 Tape and Reel, DAC8801 ±1 ±0.5 MSOP-8 DGK -40 °C to 85°C F01 DAC8801IDGKR 2500 Tape and Reel, DAC8801 ±1 ±0.5 SON-8 DRB -40 °C to 85°C E01 DAC8801IDRBT 250 Tape and Reel, DAC8801 ±1 ±0.5 SON-8 DRB -40 °C to 85°C E01 DAC8801IDRBR 2500 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or refer to our web site at www.ti.com. over operating free-air temperature range (unless otherwise noted) DAC8801 UNITS VDD to GND –0.3 to 7 V Digital Input voltage to GND –0.3 to +VDD + 0.3 V VOUT to GND –0.3 to +VDD + 0.3 V Operating temperature range –40 to 105 °C VREF, RFB to GND –25 to 25 V Storage temperature range –65 to 150 °C Junction temperature range (TJ max) 125 °C Power dissipation (TJ max – TA) / RΘJA W Thermal impedance, RΘJA 55 °C/W Lead temperature, soldering Vapor phase (60s) 215 °C Lead temperature, soldering Infrared (15s) 220 °C ESD rating, HBM 4000 V ESD rating, CDM 1000 V (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. 2 Submit Documentation Feedback |
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