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CD4014BME4 bảng dữ liệu(PDF) 7 Page - Texas Instruments

tên linh kiện CD4014BME4
Giải thích chi tiết về linh kiện  CMOS 8-stage Static Shift Registers
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nhà sản xuất  TI1 [Texas Instruments]
Trang chủ  http://www.ti.com
Logo TI1 - Texas Instruments

CD4014BME4 bảng dữ liệu(HTML) 7 Page - Texas Instruments

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Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
no Sb/Br)
CD4021BME4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BMG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BMT
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BMTE4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BMTG4
ACTIVE
SOIC
D
16
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BNSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BNSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BNSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BPWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BPWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4021BPWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
JM38510/05754BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2010
Addendum-Page 2


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