DRGND

DRGND

ADC12DC105

SNAS469B – SEPTEMBER 2008 – REVISED MARCH 2013

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PIN DESCRIPTIONS (continued)

Pin No.

Symbol

Equivalent Circuit

Description

Digital data output pins that make up the 12-bit conversion result for

42-49,

DA0-DA7,

Channel A. DA0 (pin 42) is the LSB, while DA11 (pin 55) is the MSB

52-55

DA8-DA11

of the output word. Output levels are CMOS compatible.

Digital data output pins that make up the 12-bit conversion result for

23-24,

DB0-DB1,

Channel B. DB0 (pin 23) is the LSB, while DB11 (pin 36) is the MSB

27-36

DB3-DB11

of the output word. Output levels are CMOS compatible.

Data Ready Strobe. The data output transition is synchronized with

39

DRDY

the falling edge of this signal. This signal switches at the same

frequency as the CLK input.

ANALOG POWER

Positive analog supply pins. These pins should be connected to a

8, 16, 17, 58,

quiet source and be bypassed to AGND with 0.1 µF capacitors

60

located close to the power pins.

The ground return for the analog supply.

1, 4, 12, 15,

AGND

The exposed pad on back of package must be soldered to ground

Exposed Pad

plane to ensure rated performance.

DIGITAL POWER

Positive driver supply pin for the output drivers. This pin should be

26, 38,50

connected to a quiet voltage source and be bypassed to DRGND

with a 0.1 µF capacitor located close to the power pin.

The ground return for the digital output driver supply. This pins

25, 37, 51

DRGND

should be connected to the system digital ground, but not be

connected in close proximity to the ADC's AGND pins.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3) (4) (5)

−0.3V to 4.2V

Voltage on Any Pin (Not to exceed 4.2V)

±5 mA

±50 mA

+150°C

Thermal Resistance (

30°C/W

2500V

ESD Rating

250V

Storage Temperature

−65°C to +150°C

(1)

All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance

characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the

maximum Operating Ratings is not recommended.

(3)

Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.

(4)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(5)

Reflow temperature profiles are different for lead-free and non-lead-free packages.

(6)

limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power

supplies with an input current of ±5 mA to 10.

(7)

Human Body Model is 100 pF discharged through a 1.5 k

Ω resistor. Machine Model is 220 pF discharged through 0 Ω.

4

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