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KMPC875CZT66 bảng dữ liệu(PDF) 9 Page - Freescale Semiconductor, Inc

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MPC875/MPC870 Hardware Specifications, Rev. 3.0
Freescale Semiconductor
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
9
Thermal Characteristics
4
Thermal Characteristics
Table 4 shows the thermal characteristics for the MPC875/870.
5
Power Dissipation
Table 5 provides information on power dissipation. The modes are 1:1, where CPU and bus speeds are
equal, and 2:1, where CPU frequency is twice bus speed.
Table 4. MPC875/870 Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction-to-ambient 1
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
Natural convection
Single-layer board (1s)
RθJA
2
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
43
°C/W
Four-layer board (2s2p)
RθJMA
3
3 Per JEDEC JESD51-6 with the board horizontal.
29
Airflow (200 ft/min)
Single-layer board (1s)
RθJMA
3
36
Four-layer board (2s2p)
RθJMA
3
26
Junction-to-board 4
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
RθJB
20
Junction-to-case 5
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
RθJC
10
Junction-to-package top 6
6 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
Natural convection
ΨJT
2
Airflow (200 ft/min)
ΨJT
2
Table 5. Power Dissipation (PD)
Die Revision
Bus
Mode
Frequency
Typical 1
1 Typical power dissipation is measured at V
DDL = VDDSYN = 1.8 V, and VDDH is at 3.3 V.
Maximum 2
Unit
0
1:1
66 MHz
310
390
mW
80 MHz
350
430
mW
2:1
133 MHz
430
495
mW


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