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KMPC870ZT66 bảng dữ liệu(PDF) 11 Page - Freescale Semiconductor, Inc |
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KMPC870ZT66 bảng dữ liệu(HTML) 11 Page - Freescale Semiconductor, Inc |
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11 / 84 page  MPC875/MPC870 Hardware Specifications, Rev. 3.0 Freescale Semiconductor PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE 11 Thermal Calculation and Measurement 7 Thermal Calculation and Measurement For the following discussions, PD = (VDDL × IDDL) + PI/O, where PI/O is the power dissipation of the I/O drivers. NOTE The VDDSYN power dissipation is negligible. 7.1 Estimation with Junction-to-Ambient Thermal Resistance An estimation of the chip junction temperature, TJ, in °C can be obtained from the following equation: TJ = TA + (RθJA × PD) where: TA = ambient temperature ºC RθJA = package junction-to-ambient thermal resistance (ºC/W) PD = power dissipation in package The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor of two (in the quantity TJ–TA) are possible. 7.2 Estimation with Junction-to-Case Thermal Resistance Historically, thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: RθJA = RθJC + RθCA where: RθJA = junction-to-ambient thermal resistance (ºC/W) RθJC = junction-to-case thermal resistance (ºC/W) RθCA = case-to-ambient thermal resistance (ºC/W) RθJC is device-related and cannot be influenced by the user. The user adjusts the thermal environment to affect the case-to-ambient thermal resistance, RθCA. For instance, the user can change the airflow around the device, add a heat sink, change the mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most packages, a better model is required. 4 Input capacitance is periodically sampled. 5 A(0:31), TSIZ0/REG, TSIZ1, D(0:31), IRQ(2:4), IRQ6, RD/WR, BURST, IP_B(0:1), PA(0:4), PA(6:7), PA(10:11), PA15, PB19, PB(23:31), PC(6:7), PC(10:13), PC15, PD8, PE(14:31), MII1_CRS, MII_MDIO, MII1_TXEN, MII1_COL. 6 BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:7), WE(0:3), BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1, GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A, OP(0:3) BADDR(28:30 |
Số phần tương tự - KMPC870ZT66 |
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Mô tả tương tự - KMPC870ZT66 |
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