LM98725 datasheet(6/145 Pages) TI1

tên linh kiện	LM98725

Giải thích chi tiết về linh kiện	3 Channel, 16-Bit, 81 MSPS Analog Front End

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LM98725

SNAS474H – APRIL 2009 – REVISED MARCH 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2) (3)

MIN

MAX

UNIT

Any Positive Supply Voltage (VA, VR, VD, VC)

4.2

V

Voltage on Any Input or Output Pin (except DVB) (Not to exceed 4.2V)

−0.3

4.2

V

DVB Output Voltage

2.0

V

Input Current at any pin(4)

±25

mA

Package Input Current(4)

±50

mA

Package Dissipation at TA = 25°C

(5)

1.9

W

Soldering Temperature, Infrared, 10 seconds(6)

235

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions. Operation of the device beyond the Operating Ratings is not

recommended.

(2)

All voltages are measured with respect to AGND = DGND = 0V, unless otherwise specified.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > VA or VD), the current at that pin should be

limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can simultaneously safely exceed the

power supplies with an input current of 25 mA to two.

(5)

The absolute maximum junction temperature (TJMAX) for this device is 150°C. The maximum allowable power dissipation is dictated by

TJMAX, the junction to ambient thermal resistance (RθJA), and the ambient temperature (TA), and can be calculated using the formula

PDMAX = (TJMAX - TA)/RθJA. The values for maximum power dissipation listed will be reached only when the LM98725 is operated in a

severe faulty condition.

(6)

See AN450, “Surface Mounting Methods and Their Effect on Product Reliability”, or the section entitled “Surface Mount” found in any

post 1986 Texas Instruments Semiconductor Linear Data Book, for other methods of soldering surface mount devices.

6.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

−65

+150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

2500

pins(2)

V(ESD)

Electrostatic discharge(1)

V

Charged device model (CDM), per JEDEC specification

250

JESD22-C101, all pins(3)

(1)

Human body model is 100 pF capacitor discharged through a 1.5-k

Ω resistor. Machine model is 220-pF discharged through 0Ω.

(2)

JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process.

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

(1) (2)

MIN

MAX

UNIT

Operating Temperature Range

0

≤ TA ≤ +70

°C

All Supply Voltage

+3.0

+3.6

V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions. Operation of the device beyond the Operating Ratings is not

recommended.

(2)

All voltages are measured with respect to AGND = DGND = 0V, unless otherwise specified.

6

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