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LM25019SD bảng dữ liệu(PDF) 5 Page - Texas Instruments |
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LM25019SD bảng dữ liệu(HTML) 5 Page - Texas Instruments |
5 / 28 page LM25019 www.ti.com SNVS952E – DECEMBER 2012 – REVISED NOVEMBER 2015 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT VIN, UVLO to RTN –0.3 53 V SW to RTN –1.5 VIN + 0.3 V SW to RTN (100 ns transient) –5 VIN + 0.3 V BST to VCC 53 V BST to SW 13 V RON to RTN –0.3 53 V VCC to RTN –0.3 13 V FB to RTN –0.3 5 V Lead Temperature(2) 200 °C Maximum Junction Temperature(3) 150 °C Storage temperature, Tstg –55 150 °C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are conditions under which operation of the device is intended to be functional. For specifications and test conditions, see Electrical Characteristics . The RTN pin is the GND reference electrically connected to the substrate. (2) For detailed information on soldering plastic SO Power PAD-8 package, refer to the Packaging Data Book available from Texas Instruments. Max solder time not to exceed 4 seconds. (3) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±750 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN Voltage 7.5 48 V Operating Junction Temperature(2) −40 125 °C (1) Recommended Operating Conditions are conditions under the device is intended to be functional. For specifications and test conditions, see Electrical Characteristics. (2) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C. 6.4 Thermal Information LM25019 SO PowerPAD THERMAL METRICS(1) WSON NGU UNIT DDA 8 PINS RθJA Junction-to-ambient thermal resistance 41.3 41.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 3.2 2.4 °C/W ΨJB Junction-to-board thermal characteristic parameter 19.2 24.4 °C/W RθJB Junction-to-board thermal resistance 19.1 30.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 34.7 37.3 °C/W ΨJT Junction-to-top thermal characteristic parameter 0.3 6.7 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM25019 |
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