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LM3262 bảng dữ liệu(PDF) 4 Page - Texas Instruments

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LM3262 bảng dữ liệu(HTML) 4 Page - Texas Instruments

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LM3262
SNVS875O – AUGUST 2012 – REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VIN to SGND
−0.2
6
V
PGND to SGND
−0.2
0.2
V
EN, VCON, BPEN
(SGND
− 0.2)
(VIN + 0.2)
V
FB, SW
(PGND
− 0.2)
(VIN + 0.2)
V
Continuous power dissipation(3)
Internally limited
Junction temperature, TJ-MAX
150
°C
Maximum lead temperature (soldering, 10 sec)
260
°C
Storage temperature, Tstg
−65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to the potential at the GND pins.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typical) and
disengages at TJ = 130°C (typical).
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1250
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Input voltage, VIN
2.5
5.5
V
PWM mode
0
800
mA
Recommended load current
Bypass mode
0
1000
mA
Junction temperature, TJ
–30
125
°C
Ambient temperature, TA
(2)
−30
90
°C
(1)
All voltages are with respect to the potential at the GND pins
(2)
In applications where high-power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
6.4 Thermal Information
LM3262
THERMAL METRIC(1)
YFQ (DSBGA)
UNIT
9 PINS
RθJA
Junction-to-ambient thermal resistance
85
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2012–2015, Texas Instruments Incorporated
Product Folder Links: LM3262


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