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LM137KG-MW8 bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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LM137KG-MW8 bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 28 page LM137, LM337-N SNVS778E – MAY 1999 – REVISED JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings MIN MAX UNIT Power dissipation Internally Limited Input-output voltage differential –0.3 40 V LM137 –55 150 Operating junction temperature LM337-N 0 125 °C LM337I –40 125 Storage temperature, Tstg –65 150 °C 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000 V may actually have higher performance. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT LM137 –55 150 Operating junction temperature LM337-N 0 125 °C LM337I –40 125 6.4 Thermal Information LM137 LM337-N NDT NDT DCY NDE OR NDG THERMAL METRIC(1) UNIT (TO) (TO) (SOT-223) (TO-220) 3 PINS 3 PINS 3 PINS 3 PINS RθJA Junction-to-ambient thermal resistance 140(2) 140(2) 58.3 22.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 12 12 36.6 15.7 °C/W RθJB Junction-to-board thermal resistance — — 7.2 4.1 °C/W ψJT Junction-to-top characterization parameter — — 1.3 2.4 °C/W ψJB Junction-to-board characterization parameter — — 7 4.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — 1 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) No heat sink. 4 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM137 LM337-N |
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Mô tả tương tự - LM137KG-MW8 |
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