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LMZ12008TZ bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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LMZ12008TZ bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 35 page 4 LMZ12008 SNVS716H – MARCH 2011 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: LMZ12008 Submit Documentation Feedback Copyright © 2011–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) For soldering specifications, refer to the following document: SNOA549 6 Specification 6.1 Absolute Maximum Ratings (1) (2) (3) MIN MAX UNIT VIN to PGND –0.3 24 V EN to AGND –0.3 5.5 V SS, FB to AGND –0.3 2.5 V AGND to PGND –0.3 0.3 V Junction Temperature 150 °C Peak Reflow Case Temperature (30 sec) 245 °C Storage Temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics. 6.3 Recommended Operating Conditions (1) MIN MAX UNIT VIN 6 20 V EN 0 5 V Operation Junction Temperature −40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LMZ12008 UNIT NDY 11 PINS RθJA Junction-to-ambient thermal resistance Natural Convection 9.9 °C/W 225 LFPM 6.8 500 LFPM 5.2 RθJC(top) Junction-to-case (top) thermal resistance 1.0 °C/W |
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