TS31023/223

Final Datasheet

Rev 1.1

March 19, 2015

www.semtech.com

8 of 15

Semtech

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Application Using A Multi-Layer PCB

Multi-Layer Board (Cross-sectional View)

JEDEC standard FR4 PCB Cross-section:

In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to

the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias,

thickness of copper, etc.

To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed

when laying out this part on the PCB.

The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane.