MCU

(MSP43x)

Temp.

Sensor

Y

EN

B

A

SN74AHC1G09

www.ti.com

SCLS724C – MAY 2011 – REVISED JANUARY 2016

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The SN74AHC1G09 is used in the following example in a basic power sequencing configuration. Power

sequencing is often used in applications that require a processor or other delicate device with specific voltage

timing requirements in order to protect the device from malfunctioning.

9.2 Typical Application

Figure 3. Typical Application Diagram

9.2.1 Design Requirements

This device uses CMOS technology. Take care to avoid bus contention because it can drive currents that would

exceed maximum limits. The high drive will also create fast edges into light loads so routing and load conditions

should be considered to prevent ringing.

9.2.2 Detailed Design Procedure

1. Recommended Input Conditions:

–

Rise time and fall time specifications. See (

Δt/ΔV) in Recommended Operating Conditions.

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–

2. Absolute Maximum Conditions:

–

–

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