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TS3USB221
SCDS220I – NOVEMBER 2006 – REVISED JANUARY 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
4.6
V
VIN
Control input voltage(2) (3)
–0.5
7
V
VI/O
Switch I/O voltage(2) (3) (4)
–0.5
7
V
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
II/O
ON-state switch current(5)
±120
mA
Continuous current through VCC or GND
±100
mA
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to ground, unless otherwise specified.
(3)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4)
VI and VO are used to denote specific conditions for VI/O.
(5)
II and IO are used to denote specific conditions for II/O.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
2000
V
6.3 Recommended Operating Conditions
See
(1).
MIN
MAX
UNIT
VCC
Supply voltage
2.3
3.6
V
VCC = 2.3 V to 2.7 V
VIH
High-level control input voltage
0.46 × VCC
VCC
V
VCC = 2.7 V to 3.6 V
VCC = 2.3 V to 2.7 V
VIL
Low-level control input voltage
0
0.25 × VCC
V
VCC = 2.7 V to 3.6 V
VI/O
Data input/output voltage
0
5.5
V
TA
Operating free-air temperature
–40
85
°C
(1)
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
6.4 Thermal Information
TS3USB221
THERMAL METRIC(1)
DRC (VSON)
RSE (UQFN)
UNIT
10 PINS
10 PINS
RθJA
Junction-to-ambient thermal resistance
57.7
169.8
RθJC(top)
Junction-to-case (top) thermal resistance
87.7
84.7
RθJB
Junction-to-board thermal resistance
32.6
94.9
°C/W
ψJT
Junction-to-top characterization parameter
8.2
5.7
ψJB
Junction-to-board characterization parameter
32.8
94.9
RθJC(bot)
Junction-to-case (bottom) thermal resistance
18.5
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2006–2016, Texas Instruments Incorporated
Product Folder Links: TS3USB221


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