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LM15851NKE10 bảng dữ liệu(PDF) 2 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  Ultra-Wideband RF Sampling Subsystem
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LM15851NKE10 bảng dữ liệu(HTML) 2 Page - Texas Instruments

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LM15851
SLAS990D – JANUARY 2014 – REVISED JULY 2015
www.ti.com
Table of Contents
7.6
Register Map........................................................... 47
1
Features .................................................................. 1
8
Application and Implementation ........................ 72
2
Applications ........................................................... 1
8.1
Application Information............................................ 72
3
Description ............................................................. 1
8.2
Typical Application ................................................. 72
4
Revision History..................................................... 2
8.3
Initialization Set-Up ................................................. 74
5
Pin Configuration and Functions ......................... 3
8.4
Dos and Don'ts........................................................ 74
6
Specifications......................................................... 8
9
Power Supply Recommendations ...................... 75
6.1
Absolute Maximum Ratings ...................................... 8
9.1
Supply Voltage ........................................................ 75
6.2
ESD Ratings.............................................................. 9
10
Layout................................................................... 76
6.3
Recommended Operating Conditions ....................... 9
10.1
Layout Guidelines ................................................. 76
6.4
Thermal Information .................................................. 9
10.2
Layout Example .................................................... 76
6.5
Electrical Characteristics........................................... 9
10.3
Thermal Management ........................................... 79
6.6
Timing Requirements .............................................. 13
11
Device and Documentation Support ................. 79
6.7
Internal Characteristics ........................................... 15
11.1
Device Support...................................................... 79
6.8
Switching Characteristics ........................................ 16
11.2
Documentation Support ........................................ 81
6.9
Typical Characteristics ............................................ 18
11.3
Community Resource............................................ 81
7
Detailed Description ............................................ 23
11.4
Trademarks ........................................................... 81
7.1
Overview ................................................................. 23
11.5
Electrostatic Discharge Caution ............................ 81
7.2
Functional Block Diagram ....................................... 23
11.6
Glossary ................................................................ 81
7.3
Feature Description................................................. 24
12
Mechanical, Packaging, and Orderable
7.4
Device Functional Modes........................................ 42
Information ........................................................... 81
7.5
Programming........................................................... 45
4 Revision History
Changes from Revision C (September 2014) to Revision D
Page
Deleted references to time stamp including pin names (TMST+, TMST–). .......................................................................... 6
Added additional voltage difference parameters to the Absolute Maximum Ratings table .................................................... 8
Added junction temperature to the Absolute Maximum Ratings table ................................................................................... 8
Added common mode voltage parameter to the Recommended Operating Conditions table. Changed CLK to
SYSREF, and ~SYNC ........................................................................................................................................................... 9
Deleted the Differential Analog Input Connection image in The Analog Inputs section ...................................................... 24
Added note about offset adjust in Background Calibration Mode to the Offset Adjust section and I/O offset register
tables .................................................................................................................................................................................... 28
Added the Calibration Cycle Timing for Different Calibration Modes and Options table in the Timing Calibration
Mode section ........................................................................................................................................................................ 43
Changed 0x004-0x005 to RESERVED in the Standard SPI-3.0 Registers summary table................................................. 50
Changed the name of bit 0 in the Clock Generator Control 0 Register from DC_LVPECL_TS_EN to
DC_LVPECL_SYNC_en ...................................................................................................................................................... 55
Changes from Revision B (February 2014) to Revision C
Page
Changed the device status from Product Preview to Production Data .................................................................................. 1
2
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