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ADS42B49 bảng dữ liệu(PDF) 9 Page - Texas Instruments |
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ADS42B49 bảng dữ liệu(HTML) 9 Page - Texas Instruments |
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9 / 65 page  ADS42B49 www.ti.com SBAS558C – DECEMBER 2012 – REVISED DECEMBER 2015 8.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions over operating free-air temperature range, unless otherwise noted. PARAMETER MIN NOM MAX UNIT SUPPLIES AVDD Analog supply voltage 1.8 1.9 2 V AVDD_BUF Analog buffer supply voltage 3.15 3.3 3.45 V DRVDD Digital supply voltage 1.7 1.8 2 V ANALOG INPUTS VID Differential input voltage range 2 VPP VICR Input common-mode voltage VCM ± 0.05 V Maximum analog input frequency with 2-VPP input amplitude (1) 400 MHz Maximum analog input frequency with 1.6-VPP input amplitude (1) 500 MHz CLOCK INPUT Low-speed mode enabled(2) 1 80 MSPS Input clock sample rate Low-speed mode disabled(2) (by default after reset) 80 250 MSPS Sine wave, ac-coupled 0.2 1.5 VPP LVPECL, ac-coupled 1.6 VPP Input clock amplitude differential (VCLKP – VCLKM) LVDS, ac-coupled 0.7 VPP LVCMOS, single-ended, ac-coupled 1.5 V Input clock duty Low-speed mode disabled 45% 50% 55% cycle Low-speed mode enabled 40% 50% 60% DIGITAL OUTPUTS CLOAD Maximum external load capacitance from each output pin to DRGND 3.3 pF RLOAD Differential load resistance between the LVDS output pairs (LVDS mode) 100 Ω TA Operating free-air temperature –40 85 °C (1) See the Analog Input section in the Application Information. (2) See the Serial Interface Configuration section for details on programming the low-speed mode. 8.4 Thermal Information ADS42B49 THERMAL METRIC(1) RGC (VQFN) UNIT 64 PINS RθJA Junction-to-ambient thermal resistance 23.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 10.9 °C/W RθJB Junction-to-board thermal resistance 4.3 °C/W ψJT Junction-to-top characterization parameter 0.1 °C/W ψJB Junction-to-board characterization parameter 4.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: ADS42B49 |
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