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LMX2485Q-Q1
SNOSCP7A – MARCH 2013 – REVISED JANUARY 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Power supply voltage
–0.3
4.25
V
Vi
Voltage on any pin with GND = 0 V
–0.3
VCC + 0.3
V
TL
Lead temperature (solder 4 sec.)
260
°C
Tstg
Storage temperature
-65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings – Commercial
VALUE
UNIT
Human-body model (HBM)
±2000
V(ESD)
Electrostatic discharge(1)
Charged-device model (CDM)
±750
V
Machine model (MM)
±200
(1)
This is a high performance RF device is ESD-sensitive. Handling and assembly of this device should be done at an ESD free
workstation.
6.3 ESD Ratings – Automotive
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
±2000
V(ESD)
Electrostatic discharge
Charged-device model (CDM), per AEC Q100-011
±750
V
±200
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VCC
Power supply voltage(1)
2.5
3
3.6
V
TA
Operating temperature
–40
25
105
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications
and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. The voltage at
all the power supply pins of VddRF1, VddRF2, VddRF3, VddRF4, VddRF5, VddIF1 and VddIF2 must be the same. VCC will be used to
refer to the voltage at these pins and ICC will be used to refer to the sum of all currents through all these power pins.
6.5 Thermal Information
LMX2485Q-Q1
THERMAL METRIC(1)
RTW (WQFN)
UNIT
24 PINS
RθJA
Junction-to-ambient thermal resistance
47.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
43
°C/W
RθJB
Junction-to-board thermal resistance
24
°C/W
ψJT
Junction-to-top characterization parameter
0.8
°C/W
ψJB
Junction-to-board characterization parameter
24
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
7
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: LMX2485Q-Q1


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