LM397

SNOS977E – MAY 2001 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

30

30

V

Supply voltages

±15

30

V

Voltage at input pins

−0.3

30

V

150

ºC

Infrared or Convection (20 sec.)

235

ºC

Soldering

information

Wave Soldering (10 sec.)

260

ºC

−65

150

ºC

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

5

30

V

−40

85

°C

(1)

6.4 Thermal Information

LM397

DBV (SOT-23)

UNIT

5 PINS

186

°C/W

Junction-to-case (top) thermal resistance

92.8

°C/W

Junction-to-board thermal resistance

38.9

°C/W

Junction-to-top characterization parameter

5.6

°C/W

Junction-to-board characterization parameter

38.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

4

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