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4 / 39 page LM7321, LM7322 SNOSAW8E – MAY 2008 – REVISED SEPTEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN Differential ±10 V Output Short Circuit Current See (3) Supply Voltage (VS = V + - V−) 35 V Voltage at Input/Output pins V+ + 0.8 V− − 0.8 V Junction Temperature(4) 150 °C Soldering Infrared or Convection (20 sec.) 235 °C Information: Wave Soldering (10 sec.) 260 °C Storage Temperature −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Short circuit test is a momentary test. Output short circuit duration is infinite for VS ≤ 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5 ms. (4) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(2) ±2000 Charged-device model (CDM), per JEDEC specification JESD22- V(ESD) Electrostatic discharge(1) ±1000 V C101(3) Machine Model 200 (1) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). (2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX UNIT Supply Voltage (VS = V + - V−) 2.5 32 V Temperature Range(1) −40 125 °C (1) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB. 7.4 Thermal Information LM7321 THERMAL METRIC(1) D (SOIC) DBV (SOT) DGK (VSSOP) UNIT 8 PINS 5 PINS 8 PINS RθJA (2) Junction-to-ambient thermal resistance 165 325 235 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)) – TA)/ RθJA. All numbers apply for packages soldered directly onto a PCB. 4 Submit Documentation Feedback Copyright © 2008–2015, Texas Instruments Incorporated Product Folder Links: LM7321 LM7322 |
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