BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4 × 4 MINIMUM

TJmax = 150°C.

TOLERANCES ARE ± 10%.

ALL DIMENSIONS ARE IN MILS.

+

–

OUT

IN +

IN –

VCC+

(7)

(3)

(2)

(6)

(4)

VCC –

(5)

(1)

OFFSET N2

OFFSET N1

45

36

(1)

(8)

(7)

(6)

(5)

(4)

(3)

(2)

uA741

SLOS094E – NOVEMBER 1970 – REVISED JANUARY 2015

www.ti.com

8.3 Feature Description

8.3.1 Offset-Voltage Null Capability

The input offset voltage of operational amplifiers (op amps) arises from unavoidable mismatches in the

differential input stage of the op-amp circuit caused by mismatched transistor pairs, collector currents, current-

gain betas (

β), collector or emitter resistors, etc. The input offset pins allow the designer to adjust for these

mismatches by external circuitry. See the Application and Implementation section for more details on design

techniques.

8.3.2 Slew Rate

The slew rate is the rate at which an operational amplifier can change its output when there is a change on the

input. The µA741 has a 0.5-V/

μs slew rate. Parameters that vary significantly with operating voltages or

temperature are shown in the Typical Characteristics graphs.

8.4 Device Functional Modes

The µA741 is powered on when the supply is connected. It can be operated as a single supply operational

amplifier or dual supply amplifier depending on the application.

8.5 µA741Y Chip Information

This chip, when properly assembled, displays characteristics similar to the µA741C. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

10

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