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LMV932Q1MA/NOPB bảng dữ liệu(PDF) 4 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  Single, Dual, Quad 1.8-V, RRIO Operational Amplifiers
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LMV931-N, LMV931-N-Q1
LMV932-N, LMV932-N-Q1, LMV934-N, LMV934-N-Q1
SNOS993O – NOVEMBER 2001 – REVISED DECEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
See
(1) (2).
MIN
MAX
UNIT
Supply voltage ( V+– V)
–0.3
6
Differential input voltage
V-
V+
V
Voltage at input/output pins
(V- ) - 0.3
(V+) + 0.3
Junction temperature(3)
–40
150
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but specific performance is not specified. For specifications and the test
conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3)
The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PC board.
6.2 Handling Ratings - Commercial
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-
–2000
2000
001, all pins(1) (2)
Electrostatic
V(ESD)
Charged device model (CDM), per JEDEC specification
V
discharge
–750
750
JESD22-C101, all pins(3)
Machine Model (MM)(4)
–200
200
(1)
JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2)
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(3)
JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.
(4)
Machine model, 200
Ω in series with 100-pF.
6.3 Handling Ratings - Automotive
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per AEC Q100-002(1)
–2000
2000
V(ESD)
Electrostatic discharge
Charged device model (CDM), per AEC Q100-011
–750
750
V
Machine Model (MM)(2)
–200
200
(1)
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(2)
Machine model, 200
Ω in series with 100-pF.
6.4 Recommended Operating Ratings
See
(1).
MIN
MAX
UNIT
Supply Voltage Range ( V+– V)
1.8
5.5
V
Temperature Range
−40
125
°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is intended to be functional, but specific performance is not specified. For specifications and the test
conditions, see the Electrical Characteristics.
6.5 Thermal Information
LMV921
LMV922
LMV924
THERMAL METRIC(1)
DCK
DBV
DGK
D
DGK
D
UNIT
5 PINS
8 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
414
265
235
175
155
127
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2001–2014, Texas Instruments Incorporated
Product Folder Links: LMV931-N LMV931-N-Q1 LMV932-N LMV932-N-Q1 LMV934-N LMV934-N-Q1


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