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TS321
SLOS489C – DECEMBER 2005 – REVISED APRIL 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Single Supply
32
VCC
Supply voltage
V
Dual Supplies
±16
VID
Differential input voltage(2)
±32
V
VI
Input voltage range (3)
–0.3
32
V
IIK
Input current
50
mA
tshort
Duration of output short circuit to ground
Unlimited
TJ
Operating virtual junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Differential voltages are at IN+ with respect to IN–.
(3)
Input voltages are at IN with respect to VCC–.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2500
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±1500
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
MAX
UNIT
Single supply
3
30
VCC
Supply voltage
V
Dual supply
±1.5
±15
TA
Operating free-air temperature
–40
125
°C
7.4 Thermal Information
TS321
THERMAL METRIC(1)
D (SOIC)
DBV (SOT-23)
UNIT
5 PIN
5 PIN
RθJA
Junction-to-ambient thermal resistance(2)(3)
97
206
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/qJA. Selecting the maximum of 150°C can affect reliability.
(3)
The package thermal impedance is calculated in accordance with JESD 51-7.
4
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Product Folder Links: TS321


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