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TS321IDBVR bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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TS321IDBVR bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 21 page TS321 SLOS489C – DECEMBER 2005 – REVISED APRIL 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Single Supply 32 VCC Supply voltage V Dual Supplies ±16 VID Differential input voltage(2) ±32 V VI Input voltage range (3) –0.3 32 V IIK Input current 50 mA tshort Duration of output short circuit to ground Unlimited TJ Operating virtual junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Differential voltages are at IN+ with respect to IN–. (3) Input voltages are at IN with respect to VCC–. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX UNIT Single supply 3 30 VCC Supply voltage V Dual supply ±1.5 ±15 TA Operating free-air temperature –40 125 °C 7.4 Thermal Information TS321 THERMAL METRIC(1) D (SOIC) DBV (SOT-23) UNIT 5 PIN 5 PIN RθJA Junction-to-ambient thermal resistance(2)(3) 97 206 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/qJA. Selecting the maximum of 150°C can affect reliability. (3) The package thermal impedance is calculated in accordance with JESD 51-7. 4 Submit Documentation Feedback Copyright © 2005–2015, Texas Instruments Incorporated Product Folder Links: TS321 |
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