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LM13700N bảng dữ liệu(PDF) 4 Page - Texas Instruments

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LM13700
SNOSBW2F – NOVEMBER 1999 – REVISED NOVEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage
36 VDC or ±18
V
DC input voltage
+VS
−VS
V
Differential input voltage
±5
V
Diode bias current (ID)
2
mA
Amplifier bias current (IABC)
2
mA
Buffer output current(2)
20
mA
Power dissipation(3) TA = 25°C – LM13700N
570
mW
Output short circuit duration
Continuous
Storage temperature, Tstg
−65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Buffer output current should be limited so as to not exceed package dissipation.
(3)
For operation at ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a
thermal resistance, junction to ambient, as follows: LM13700N, 90°C/W; LM13700M, 110°C/W.
6.2 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V+ (single-supply configuration)
9.5
32
V
V+ (dual-supply configuration)
4.75
16
V
V– (dual-supply configuration)
–16
–4.75
V
Operating temperature, TA
LM13700N
0
70
°C
6.3 Thermal Information
LM13700
THERMAL METRIC(1)
D (SOIC)
NFG (PDIP)
UNIT
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
83.0
43.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
44.0
34.9
°C/W
RθJB
Junction-to-board thermal resistance
40.5
28.3
°C/W
ψJT
Junction-to-top characterization parameter
11.5
19.1
°C/W
ψJB
Junction-to-board characterization parameter
40.2
28.2
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LM13700


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