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LM13700N bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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LM13700N bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 37 page LM13700 SNOSBW2F – NOVEMBER 1999 – REVISED NOVEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage 36 VDC or ±18 V DC input voltage +VS −VS V Differential input voltage ±5 V Diode bias current (ID) 2 mA Amplifier bias current (IABC) 2 mA Buffer output current(2) 20 mA Power dissipation(3) TA = 25°C – LM13700N 570 mW Output short circuit duration Continuous Storage temperature, Tstg −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Buffer output current should be limited so as to not exceed package dissipation. (3) For operation at ambient temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a thermal resistance, junction to ambient, as follows: LM13700N, 90°C/W; LM13700M, 110°C/W. 6.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V+ (single-supply configuration) 9.5 32 V V+ (dual-supply configuration) 4.75 16 V V– (dual-supply configuration) –16 –4.75 V Operating temperature, TA LM13700N 0 70 °C 6.3 Thermal Information LM13700 THERMAL METRIC(1) D (SOIC) NFG (PDIP) UNIT 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 83.0 43.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 44.0 34.9 °C/W RθJB Junction-to-board thermal resistance 40.5 28.3 °C/W ψJT Junction-to-top characterization parameter 11.5 19.1 °C/W ψJB Junction-to-board characterization parameter 40.2 28.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: LM13700 |
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Mô tả tương tự - LM13700N |
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