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MMSF4P01HD bảng dữ liệu(PDF) 2 Page - ON Semiconductor |
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2 / 12 page MMSF4P01HD http://onsemi.com 2 ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) (Note 1.) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Drain−Source Breakdown Voltage (VGS = 0 Vdc, ID = 250 µAdc) Temperature Coefficient (Positive) V(BR)DSS 12 − − 22 − − Vdc mV/ °C Zero Gate Voltage Drain Current (VDS = 12 Vdc, VGS = 0 Vdc) (VDS = 12 Vdc, VGS = 0 Vdc, TJ = 125°C) IDSS − − − − 1.0 10 µAdc Gate−Body Leakage Current (VGS = ± 8.0 Vdc, VDS = 0) IGSS − − 100 nAdc ON CHARACTERISTICS (Note 3.) Gate Threshold Voltage (VDS = VGS, ID = 250 µAdc) Temperature Coefficient (Negative) VGS(th) 0.7 − 0.95 2.7 1.1 − Vdc mV/ °C Static Drain−to−Source On−Resistance (VGS = 4.5 Vdc, ID = 4.0 Adc) (VGS = 2.7 Vdc, ID = 2.0 Adc) RDS(on) − − 0.073 0.08 0.08 0.09 Ohm Forward Transconductance (VDS = 2.5 Vdc, ID = 2.0 Adc) gFS 3.0 7.0 − mhos DYNAMIC CHARACTERISTICS Input Capacitance (V 10 Vd V 0Vd Ciss − 1270 1700 pF Output Capacitance (VDS = 10 Vdc, VGS = 0 Vdc, f = 1.0 MHz) Coss − 935 1300 Reverse Transfer Capacitance f = 1.0 MHz) Crss − 420 600 SWITCHING CHARACTERISTICS (Note 4.) Turn−On Delay Time td(on) − 25 35 ns Rise Time (VDS = 6.0 Vdc, ID = 4.0 Adc, VGS =27Vdc tr − 250 350 Turn−Off Delay Time VGS = 2.7 Vdc, RG = 6.0 Ω) td(off) − 58 80 Fall Time RG 6.0 Ω) tf − 106 150 Turn−On Delay Time td(on) − 17 25 Rise Time (VDD = 6.0 Vdc, ID = 4.0 Adc, VGS =45Vdc tr − 71 100 Turn−Off Delay Time VGS = 4.5 Vdc, RG = 6.0 Ω) td(off) − 95 140 Fall Time RG 6.0 Ω) tf − 106 150 Gate Charge QT − 24 34 nC (VDS = 10 Vdc, ID = 4.0 Adc, Q1 − 2.4 − (VDS 10 Vdc, ID 4.0 Adc, VGS = 4.5 Vdc) Q2 − 11.4 − Q3 − 8.4 − SOURCE−DRAIN DIODE CHARACTERISTICS Forward On−Voltage (Note 3.) (IS = 4.0 Adc, VGS = 0 Vdc) (IS = 4.0 Adc, VGS = 0 Vdc, TJ = 125°C) VSD − − 1.3 1.1 1.8 − Vdc Reverse Recovery Time trr − 134 − ns (IS = 4.0 Adc, VGS = 0 Vdc, ta − 66 − (IS 4.0 Adc, VGS 0 Vdc, dIS/dt = 100 A/µs) tb − 68 − Reverse Recovery Stored Charge QRR − 0.33 − µC 1. Negative sign for P−Channel device omitted for clarity. 3. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%. 4. Switching characteristics are independent of operating junction temperature. |
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