BCX70GLT1

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9

PACKAGE DIMENSIONS

CASE 318−08

ISSUE AF

SOT−23 (TO−236)

D

J

K

L

A

C

B S

H

G

V

3

1

2

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

0.1102

0.1197

2.80

3.04

INCHES

B 0.0472 0.0551

1.20

1.40

C 0.0350 0.0440

0.89

1.11

D 0.0150 0.0200

0.37

0.50

G 0.0701 0.0807

1.78

2.04

H 0.0005 0.0040

0.013

0.100

J 0.0034 0.0070

0.085

0.177

K 0.0140 0.0285

0.35

0.69

L 0.0350 0.0401

0.89

1.02

S 0.0830 0.1039

2.10

2.64

V 0.0177 0.0236

0.45

0.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

STYLE 6:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

ON Semiconductor and

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

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