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MC33064LP bảng dữ liệu(PDF) 2 Page - Microsemi Corporation |
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MC33064LP bảng dữ liệu(HTML) 2 Page - Microsemi Corporation |
2 / 10 page TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT MC33064/MC34064 PRODUCT DA T ABOOK 1996/1997 Copyright © 1999 Rev. 1.3 6/99 2 P RODUCTION D AT A S HEET ABSOLUTE MAXIMUM RATINGS (Note 1) Input Supply Voltage (V IN) ............................................................................... -1V to 10V RESET Output Voltage (V OUT) ..................................................................................... 10V Output Sink Current (I OL) ............................................................ Internally Limited (mA) Clamp Diode Forward Current (I F), Pin 1 to pin 2 ............................................... 100mA Operating Junction Temperature Plastic (DM, LP - Packages) .................................................................................. 150°C Storage Temperature Range ...................................................................... -65°C to 150°C Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C PACKAGE PIN OUTS DM PACKAGE (Top View) Note 1. Values beyond which damage may occur. All voltages are specified with respect to ground, and all currents are positive into the specified terminal. DM PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 165°C/W LP PACKAGE: THERMAL RESISTANCE-JUNCTION TO AMBIENT, θθθθθ JA 156°C/W Junction Temperature Calculation: T J = TA + (PD x θJA). The θ JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow THERMAL DATA BLOCK DIAGRAM LP PACKAGE (Top View) 3. GROUND 2. V IN 1. RESET RESET V IN N.C. GROUND N.C. N.C. N.C. N.C. 18 27 36 45 1.2 V REF V IN RESET GROUND |
Số phần tương tự - MC33064LP |
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Mô tả tương tự - MC33064LP |
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