10

3

x 10

Temperature Range

Voltage

Temperature

LM4030

www.ti.com

SNVS552B – MARCH 2008 – REVISED APRIL 2013

TEMPERATURE COEFFICIENT

Temperature drift is defined as the maximum deviation in output voltage over the temperature range. This

deviation over temperature may be illustrated as shown in Figure 25.

Temperature coefficient may be expressed analytically as the following:

where

•

•

•

•

•

ΔT = Operating temperature range

(3)

The LM4030 features a low temperature drift of 10ppm (max) to 30ppm (max), depending on the grade.

DYNAMIC OFFSET CANCELLATION AND LONG TERM STABILITY

Aside from initial accuracy and drift performance, other specifications such as thermal hysteresis and long-term

stability can affect the accuracy of a voltage reference, especially over the lifetime of the application. The

reference voltage can also shift due to board stress once the part is mounted onto the PCB and during

subsequent thermal cycles. Generally, these shifts in VREF arise due to offsets between matched devices within

the regulation loop. Both passive and active devices naturally experience drift over time and stress and

temperature gradients across the silicon die also generate offset. The LM4030 incorporates a dynamic offset

cancellation scheme which compensates for offsets developing within the regulation loop. This gives the LM4030

excellent long-term stability (40 ppm typical) and thermal hysteresis performance (75ppm typical), as well as

substantial immunity to PCB stress effects, despite being packaged in a tiny SOT-23.

EXPRESSION OF ELECTRICAL CHARACTERISTICS

Electrical characteristics are typically expressed in mV, ppm, or a percentage of the nominal value. Depending

on the application, one expression may be more useful than the other. To convert one quantity to the other one

may apply the following:

ppm to mV error in output voltage:

where

•

(4)

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