LM2766

SNVS071C – MARCH 2000 – REVISED SEPTEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

5.8

V

SD

(GND

− 0.3)

(V+ + 0.3)

V

40

mA

1

sec

(4)

600

mW

(4)

150

°C

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.

(3)

device may be damaged.

(4)

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Junction temperature

−40

100

°C

Ambient temperature

−40

85

°C

Lead temperature (soldering, 10 sec.)

240

°C

6.4 Thermal Information

LM2766

DBV (SOT-23)

UNIT

6 PINS

Junction-to-ambient thermal resistance

210

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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