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TC1306R-BDVUA bảng dữ liệu(PDF) 2 Page - Microchip Technology |
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2 / 16 page TC1306 DS21527B-page 2 © 2002 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS* Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN +0.3V) Power Dissipation................Internally Limited (Note 7) Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V Operating Temperature Range.... -40°C < TJ < +125°C Storage Temperature Range .............. -65°C to +150°C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1306 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN =VR +1V, IL =100µA, CL =3.3µF, SHDN1 >VIH, SHDN2 >VIH,TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperature of -40°C to +125°C. Applies to both VOUT1 and VOUT2. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Operating Voltage 2.7 — 6.0 V Note 1 IOUTMAX Maximum Output Current 150 — — mA Per Channel VOUT Output Voltage (VOUT1 and VOUT2) VR –2.5% VR ±0.5% VR +2.5% V Note 2 TCVOUT VOUT Temperature Coefficient — — 20 40 — — ppm/°C Note 3 ∆VOUT/∆VIN Line Regulation — 0.05 0.35 %(VR +1V) < VIN < 6V ∆VOUT/VOUT Load Regulation — 0.3 2 %IL = 0.1mA to IOUTMAX (Note 4) VIN – VOUT Dropout Voltage — 2 45 85 125 — 120 240 360 mV IL =100µA IL =50mA IL =100mA IL =150mA, (Note 5) IIN Supply Current — 120 200 µA SHDN1, SHDN2 =VIH,IL =0 IINSD Shutdown Supply Current — 0.05 0.5 µA SHDN1, SHDN2 =0V PSRR Power Supply Rejection Ratio — 55 — dB FRE ≤ 120Hz IOUTSC Output Short Circuit Current — 450 — mA VOUT =0V ∆VOUT∆PD Thermal Regulation — 0.04 — V/W Notes 6, 7 tWK Wake Up Time (from Shutdown Mode) —10 — µsec VIN =5V CIN =1µF, COUT =4.7µF IL = 30mA, (See Figure 4-1) ts Settling Time (from Shutdown Mode) —40 — µsec VIN =5V CIN =1µF, COUT =4.7µF IL = 30mA, (See Figure 4-1) Note 1: The minimum VIN has to meet two conditions: VIN ≥ 2.7 and VIN =VR +VDROPOUT. 2: VR is the regulator output voltage setting. For example: VR =2.8V, 3.0V. 3: 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. 6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA,TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details. TC VOUT =(VOUTMAX –VOUTMIN)x 10 6 VOUT x ∆T |
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