LM2937-2.5_15 datasheet(4/27 Pages) TI

tên linh kiện	LM2937-2.5

Giải thích chi tiết về linh kiện	LM2937 2.5-V and 3.3-V 400-mA and 500-mA Voltage Regulators

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LM2937-2.5, LM2937-3.3

SNVS015F – FEBRUARY 1998 – REVISED NOVEMBER 2014

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Continuous

26

Input voltage (VIN)

V

Transient (t

≤ 100 ms)

60

Internal power dissipation(3)

Internally limited

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The maximum allowable power dissipation at any ambient temperature is PMAX = (125°C − TA)/RθJA, where 125°C is the maximum

junction temperature for operation, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance. If this

dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature

rises above 150°C, the LM2937 will go into thermal shutdown.

6.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

−65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–2000

2000

V(ESD)

Electrostatic discharge

V

pins(1)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

LM2937ET (NDE), LM2937ES (KTT)

−40

125

Junction temperature (TJ)

(2)

°C

LM2937IMP (DCY)

−40

85

Input voltage (VIN)

4.75

26

V

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The maximum allowable power dissipation at any ambient temperature is PMAX = (125°C − TA)/RθJA, where 125°C is the maximum

junction temperature for operation, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance. If this

dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature

rises above 150°C, the LM2937 will go into thermal shutdown.

6.4 Thermal Information

LM2937

THERMAL METRIC(1)

NDE(2)

KTT

DCY

UNIT

3 PINS

4 PINS

RθJA

Junction-to-ambient thermal resistance

77.9

41.8

58.3

RθJC(top)

Junction-to-case (top) thermal resistance

35.5

43.5

39.2

RθJB

Junction-to-board thermal resistance

70.6

23.5

7.0

°C/W

ψJT

Junction-to-top characterization parameter

13

10.3

1.6

ψJB

Junction-to-board characterization parameter

70.6

22.5

6.9

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1

0.8

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Thermal information for the TO-220 package is for a free-standing package vertically mounted in the middle of a PCB which is compliant

to the JEDEC HIGH-K 2s2p (JESD51-7) specifications. No additional heat sink is attached. See Heatsinking TO-220 Package Parts

section for more information.

4

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