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ISL21090BFB812Z-TK bảng dữ liệu(HTML) 3 Page - Intersil Corporation

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ISL21090
3
FN6993.5
February 27, 2013
Absolute Maximum Ratings
Thermal Information
Max Voltage
VIN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +40V
VOUT to GND (10s). . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to VOUT + 0.5V
Voltage on any Pin to Ground . . . . . . . . . . . . . . . . . . . -0.5V to +VOUT + 0.5V
Voltage on DNC pins . . . . . . . . . . . . . . . No connections permitted to these pins
Input Voltage Slew Rate (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.1V/µs
ESD Ratings
Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . . 3kV
Machine Model (Tested per JESD22-A115-C) . . . . . . . . . . . . . . . . . . 200V
Charged Device Model (Tested per JESD22-C110D) . . . . . . . . . . . . . 2kV
Latch-up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . . at +125°C
Thermal Resistance (Typical)
θJA (°C/W)
θJC (°C/W)
8 Ld SOIC Package (Notes 4, 5) . . . . . . . . .
110
60
Continuous Power Dissipation (TA = +125°C) . . . . . . . . . . . . . . . . .217mW
Maximum Junction Temperature (TJMAX). . . . . . . . . . . . . . . . . . . . . .+150°C
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Recommended Operating Conditions
Temperature Range (Industrial) . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. For
θJC, the “case temp” location is taken at the package top center.
6. Post-reflow drift for the ISL21090 devices can exceed 100µV to 1.0mV based on experimental results with devices on FR4 double sided boards. The
system engineer must take this into account when considering the reference voltage after assembly.
Electrical Specifications V
IN = 5V (1.25V option), IOUT = 0, CL = 0.1µF and CC = 0.01µF, unless otherwise specified. Boldface limits apply
over the operating temperature range, -40°C to +125°C.
PARAMETER
DESCRIPTION
CONDITIONS
MIN
(Note 7)
TYP
MAX
(Note 7)
UNIT
VOUT
Output Voltage
VIN = 5V,
1.25
V
VOA
VOUT Accuracy @ TA = +25°C (Note 6)
VOUT = 1.25V
-0.03
+0.03
%
TC VOUT
Output Voltage Temperature Coefficient
(Note 8)
ISL21090 B grade
7
ppm/°C
VIN
Input Voltage Range
VOUT = 1.25V
3.7
36
V
IIN
Supply Current
0.750
1.28
mA
ΔVOUT /ΔVIN
Line Regulation
VIN = 3.7V to 36V, VOUT = 1.25V
6
17
ppm/V
ΔVOUT/ΔIOUT
Load Regulation
Sourcing: 0mA ≤ IOUT ≤ 20mA
2.5
17
ppm/mA
VD
Dropout Voltage (Note 9)
VOUT = 1.25V @ 10mA
1.7
2.15
V
ISC+
Short Circuit Current
TA = +25°C, VOUT tied to GND
53
mA
tR
Turn-on Settling Time
90% of final value, CL = 1.0µF, CC = open
150
µs
Ripple Rejection
f = 120Hz
90
dB
enp-p
Voltage Noise
0.1Hz
≤ f ≤ 10Hz, VOUT = 1.25V
1.0
µVP-P
Vn
Broadband Voltage Noise
10Hz
≤ f ≤ 1kHz, VOUT = 1.25V
1.2
µVRMS
en
Noise Voltage Density
f = 1kHz, VOUT = 1.25V
25
nV/
√Hz
ΔVOUT/Δt
Long Term Stability
TA = +25°C
20
ppm


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