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BUK764R0-55B
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 22 April 2011
3 of 14
NXP Semiconductors
BUK764R0-55B
N-channel TrenchMOS standard level FET
4.
Limiting values
[1]
Continuous current is limited by package.
[2]
Current is limited by power dissipation chip rating.
[3]
Refer to document 9397 750 12572 for further information.
[4]
Maximum value not quoted. Repetitive rating defined in avalanche rating figure.
[5]
Single-pulse avalanche rating limited by maximum junction temperature of 175 °C.
[6]
Repetitive avalanche rating limited by an average junction temperature of 170 °C.
[7]
Refer to application note AN10273 for further information.
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
Tj ≥ 25 °C; Tj ≤ 175 °C
-
55
V
VDGR
drain-gate voltage
RGS =20kΩ
-55
V
VGS
gate-source voltage
-20
20
V
ID
drain current
Tmb =25°C; VGS =10V; see Figure 1;
see Figure 4
[1] -75
A
[2][3] -
193
A
Tmb =100 °C; VGS = 10 V; see Figure 1
[1] -75
A
IDM
peak drain current
Tmb = 25 °C; pulsed; tp ≤ 10 µs;
see Figure 4
-
774
A
Ptot
total power dissipation
Tmb =25°C; see Figure 2
-
300
W
Tstg
storage temperature
-55
175
°C
Tj
junction temperature
-55
175
°C
Source-drain diode
IS
source current
Tmb =25°C
[2][1] -
193
A
[1] -75
A
ISM
peak source current
pulsed; tp ≤ 10 µs; Tmb = 25 °C
-
774
A
Avalanche ruggedness
EDS(AL)S
non-repetitive drain-source
avalanche energy
ID =75A; Vsup ≤ 55 V; RGS =50 Ω;
VGS =10V; Tj(init) = 25 °C; unclamped
-1.2
J
EDS(AL)R
repetitive drain-source
avalanche energy
see Figure 3
[4][5][6][
7]
--J


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