công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
LM2735XSDX/NOPB bảng dữ liệu(PDF) 4 Page - Texas Instruments |
|
|
LM2735XSDX/NOPB bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 59 page LM2735, LM2735-Q1 SNVS485G – JUNE 2007 – REVISED AUGUST 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) MIN MAX UNIT VIN –0.5 7 V SW Voltage –0.5 26.5 V FB Voltage –0.5 3 V EN Voltage –0.5 7 V Junction Temperature(2) 150 °C Soldering Information, Infrared/Convection Reflow (15 s) 220 °C Storage Temperature –65 150 °C (1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (2) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device. 6.2 ESD Ratings: LM2735 VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22- ±1000 C101(3) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible if necessary precautions are taken. (2) The human body model is a 100-pF capacitor discharged through a 1.5-k Ω resistor into each pin. (3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible if necessary precautions are taken. 6.3 ESD Ratings: LM2735-Q1 VALUE UNIT Human body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per AEC Q100-011 ±1000 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.4 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN 2.7 5.5 V VSW 3 24 V VEN (1) 0 VIN V Junction Temperature Range –40 125 °C Power Dissipation (Internal) SOT-23 400 mW (1) Do not allow this pin to float or be greater than VIN + 0.3 V. 6.5 Thermal Information LM2735, LM2735-Q1 LM2735 NGG (WSON) DBV (SOT-23) DGN (MSOP- THERMAL METRIC(1) UNIT PowerPAD) 6 PINS 5 PINS 8 PINS RθJA Junction-to-ambient thermal resistance(2) 54.9 164.2 59 °C/W RθJC(top) Junction-to-case (top) thermal resistance(2) 50.9 115.3 51.2 °C/W RθJB Junction-to-board thermal resistance 29.3 27 35.8 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Applies for packages soldered directly onto a 3” × 3” PC board with 2-oz. copper on 4 layers in still air. 4 Submit Documentation Feedback Copyright © 2007–2015, Texas Instruments Incorporated Product Folder Links: LM2735 LM2735-Q1 |
Số phần tương tự - LM2735XSDX/NOPB |
|
Mô tả tương tự - LM2735XSDX/NOPB |
|
|
Link URL |
Chính sách bảo mật |
ALLDATASHEET.VN |
Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |