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LMZ21701 bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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LMZ21701 bảng dữ liệu(HTML) 4 Page - Texas Instruments |
4 / 37 page LMZ21701 SNVS853D – AUGUST 2012 – REVISED NOVEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN −0.3 20 V VIN +0.3 V EN, SS −0.3 w/ 20 V V max FB, PG, VOS −0.3 7 V PG sink current 10 mA Junction Temperature (TJ-MAX) −40 125 °C Maximum Lead Temperature 260 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range −65 150 °C Human body model (HBM), −2000 2000 per ANSI/ESDA/JEDEC JS-001, all pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), −500 500 per JEDEC specification JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions (1) Over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT Input Voltage Range 3 17 V Output Voltage Range 0.9 6.0 V Recommended Load Current 0 1000 mA Junction Temperature (TJ) Range −40 125 °C (1) Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications, see the Electrical Characteristics section. 7.4 Thermal Information LMZ21701 THERMAL METRIC(1) SIL0008E UNIT 8 PINS RθJA Junction-to-ambient thermal resistance(2) 42.6 RθJC(top) Junction-to-case (top) thermal resistance 20.8 RθJB Junction-to-board thermal resistance 9.4 °C/W ψJT Junction-to-top characterization parameter 1.5 ψJB Junction-to-board characterization parameter 9.3 RθJC(bot) Junction-to-case (bottom) thermal resistance 1.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Junction-to-ambient thermal resistance ( θJA) is based on 4 layer board thermal measurements, performed under the conditions and guidelines set forth in the JEDEC standards JESD51-1 to JESD51-11. θJA varies with PCB copper area, power dissipation, and airflow. 4 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: LMZ21701 |
Số phần tương tự - LMZ21701_15 |
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Mô tả tương tự - LMZ21701_15 |
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