LMZ21701_15 datasheet(4/37 Pages) TI

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LMZ21701

SNVS853D – AUGUST 2012 – REVISED NOVEMBER 2014

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN

−0.3

20

V

VIN +0.3 V

EN, SS

−0.3

w/ 20 V

V

max

FB, PG, VOS

−0.3

7

V

PG sink current

10

mA

Junction Temperature (TJ-MAX)

−40

125

°C

Maximum Lead Temperature

260

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

7.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

−65

150

°C

Human body model (HBM),

−2000

2000

per ANSI/ESDA/JEDEC JS-001, all pins(1)

V(ESD)

Electrostatic discharge

V

Charged device model (CDM),

−500

500

per JEDEC specification JESD22-C101, all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

(1)

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input Voltage Range

3

17

V

Output Voltage Range

0.9

6.0

V

Recommended Load Current

0

1000

mA

Junction Temperature (TJ) Range

−40

125

°C

(1)

Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits.

For guaranteed specifications, see the Electrical Characteristics section.

7.4 Thermal Information

LMZ21701

THERMAL METRIC(1)

SIL0008E

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance(2)

42.6

RθJC(top)

Junction-to-case (top) thermal resistance

20.8

RθJB

Junction-to-board thermal resistance

9.4

°C/W

ψJT

Junction-to-top characterization parameter

1.5

ψJB

Junction-to-board characterization parameter

9.3

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Junction-to-ambient thermal resistance (

θJA) is based on 4 layer board thermal measurements, performed under the conditions and

guidelines set forth in the JEDEC standards JESD51-1 to JESD51-11.

θJA varies with PCB copper area, power dissipation, and airflow.

4

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nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
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