NXP Semiconductors

BYV10X-600P

Ultrafast power diode

BYV10X-600P

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Product data sheet

3 January 2014

6 / 9

12. Package outline

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOD113

2-lead TO-220F

SOD113

02-04-09

07-06-18

Notes

2. z is depth of T.

UNIT

A

mm

4.6

4.0

2.9

2.5

0.9

0.7

0.7

0.4

15.8

15.2

10.3

9.7

5.08

2.7

1.7

0.6

0.4

3.3

2.8

2.55

0.4

2.6

DIMENSIONS (mm are the original dimensions)

Plastic single-ended package; isolated heatsink mounted;

1 mounting hole; 2-lead TO-220 'full pack'

0

10

20 mm

scale

b

1.1

0.9

c

D

E

e

max

19.0

max

0.5

j

k

L

14.4

13.5

m

6.5

6.3

P

3.2

3.0

Q

q

2.6

2.3

T

w

0.8

A

c

Q

k

j

m

z

e

1

2

b

E

P

q

D

T

L

Fig. 8. Package outline TO-220F (SOD113)