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AD7821 bảng dữ liệu(PDF) 4 Page - Analog Devices

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AD7821
REV. B
–4–
ABSOLUTE MAXIMUM RATINGS
*
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, + 7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, + 7 V
Digital Input Voltage to GND
(Pins 6–8, 13) . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
Digital Output Voltage to GND
(Pins 2–5, 9, 14–18) . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
VREF(+) to GND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
VREF(–) to GND . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
VIN to GND . . . . . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
Operating Temperature Range
Commercial (K Version) . . . . . . . . . . . . . . –40
°C to +85°C
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . –55
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . +300
°C
Power Dissipation (Any Package) to +75
°C . . . . . . . 450 mW
Derates above +75
°C by . . . . . . . . . . . . . . . . . . . . . 6 mW/°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PIN CONFIGURATIONS
DIP AND SOIC
LCCC
PLCC
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7821 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
PIN FUNCTION DESCRIPTIONS
Pin
Mnemonic Description
1VIN
Analog Input: Range VREF(–)
≤ V
IN
≤ V
REF(+)
2
DB0
Three-State Data Output (LSB)
3–5
DB1–DB3
Three-State Data Outputs
6
WR/RDY
WRITE control input/READY status output. See Digital Interface section.
7
MODE
Mode Selection Input. It determines whether the device operates in the WR-RD or RD mode. This input is internally
pulled low through a 50
µA current source. See Digital Interface section.
8
RD
READ Input.
RD must be low to access data from the part. See Digital Interface section.
9
INT
INTERRUPT Output.
INT going low indicates that the conversion is complete. INT returns high on the rising
edge of
CS or RD. See Digital Interface section.
10
GND
Ground
11
VREF(–)
Lower limit of reference span.
Range: VSS
≤ V
REF(–)
≤ V
REF(+).
12
VREF(+)
Upper limit of reference span.
Range: VREF(–) < VREF(+)
≤ V
DD.
13
CS
Chip Select Input. The device is selected when this input is low.
14–16
DB4–DB6
Three-State Data Outputs
17
DB7
Three-State Data Output (MSB)
18
OFL
Overflow Output. If the analog input is higher than (VREF(+) – 1/2 LSB), OFL will be low at the end of conversion. It
is a non-three-state output which can be used to cascade two or more devices to increase resolution.
19
VSS
Negative Supply Voltage
VSS = 0 V; Unipolar Operation
VSS = –5 V; Bipolar Operation
20
VDD
Positive Supply Voltage, +5 V


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