công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
SI1302DL-T1 bảng dữ liệu(PDF) 7 Page - Vishay Siliconix |
|
SI1302DL-T1 bảng dữ liệu(HTML) 7 Page - Vishay Siliconix |
7 / 9 page AN813 Vishay Siliconix www.vishay.com 2 Document Number: 71236 12-Dec-03 THERMAL PERFORMANCE Junction-to-Foot Thermal Resistance (the Package Performance) Thermal performance for the 3-pin SC-70 measured as junction-to-foot thermal resistance is 285_C/W typical, 340_C/W maximum. Junction-to-foot thermal resistance for the 6-pin SC70-6 is 105_C/W typical, 130_C/W maximum — a nearly two-thirds reduction compared with the 3-pin device. The “foot” is the drain lead of the device as it connects with the body. This improved performance is obtained by the increase in drain leads from one to four on the 6-pin SC-70. Note that these numbers are somewhat higher than other LITTLE FOOT devices due to the limited thermal performance of the Alloy 42 lead-frame compared with a standard copper lead-frame. Junction-to-Ambient Thermal Resistance (dependent on PCB size) The typical RθJAfor the single 3-pin SC-70 is 360_C/W steady state, compared with 180_C/W for the 6-pin SC-70. Maximum ratings are 430_C/W for the 3-pin device versus 220_C/W for the 6-pin device. All figures are based on the 1-inch square FR4 test board.The following table shows how the thermal resistance impacts power dissipation for the two different pin-outs at two different ambient temperatures. SC-70 (3-PIN) Room Ambient 25 _C Elevated Ambient 60 _C PD + TJ(max) * TA RqJA PD + 150oC * 25oC 360oC W PD + 347 mW PD + TJ(max) * TA RqJA PD + 150oC * 60oC 360oC W PD + 250 mW SC-70 (6-PIN) Room Ambient 25 _C Elevated Ambient 60 _C PD + TJ(max) * TA RqJA PD + 150oC * 25oC 180oC W PD + 694 mW PD + TJ(max) * TA RqJA PD + 150oC * 60oC 180oC W PD + 500 mW NOTE: Although they are intended for low-power applications, devices in the 6-pin SC-70 will handle power dissipation in excess of 0.5 W. Testing To aid comparison further, Figures 3 and 4 illustrate single-channel SC-70 thermal performance on two different board sizes and two different pad patterns. The results display the thermal performance out to steady state and produce a graphic account of the thermal performance variation between the two packages. The measured steady state values of RθJA for the single 3-pin and 6-pin SC-70 are as follows: LITTLE FOOT SC-70 3-Pin 6-Pin 1) Minimum recommended pad pattern (see Figure 4) on the EVB. 410.31_C/W 329.7_C/W 2) Industry standard 1” square PCB with maximum copper both sides. 360_C/W 211.8_C/W The results show that designers can reduce thermal resistance RθJA on the order of 20% simply by using the 6-pin device rather than the 3-pin device. In this example, a 80_C/W reduction was achieved without an increase in board area. If increasing board size is an option, a further 118_C/W reduction could be obtained by utilizing a 1-inch square PCB area. Time (Secs) FIGURE 3. Comparison of SC70-3 and SC70-6 on EVB 0 1 400 80 160 100 1000 240 10 10-1 10-2 10-3 10-4 10-5 0.5 in x 0.6 in EVB 3-pin 320 Time (Secs) FIGURE 4. Comparison of SC70-3 and SC70-6 on 1” Square FR4 PCB 0 1 400 80 160 100 1000 240 10 10-1 10-2 10-3 10-4 10-5 1” Square FR4 PCB 320 6-pin 3-pin 6-pin |
Số phần tương tự - SI1302DL-T1 |
|
Mô tả tương tự - SI1302DL-T1 |
|
|
Link URL |
Chính sách bảo mật |
ALLDATASHEET.VN |
Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |