NE325S01

9

RECOMMENDED SOLDERING CONDITIONS

The following conditions (see table below) must be met when soldering this product.

Please consult with our sales offices in case other soldering process is used, or in case soldering is done under

different conditions.

<TYPES OF SURFACE MOUNT DEVICE>

For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”

(C10535E).

Soldering process

Soldering conditions

Symbol

Infrared ray reflow

Peak package’s surface temperature: 230 ˚C or below,

IR30-00

Reflow time: 30 seconds or below (210 ˚C or higher),

Partial heating method

Terminal temperature: 230 ˚C or below,

Flow time: 10 seconds or below,

Note Exposure limit before soldering after dry-pack package is opened.

Storage conditions: 25 ˚C and relative humidity at 65 % or less.

Caution Do not apply more than a single process at once, except for “Partial heating method”.

PRECAUTION

Avoid high static voltage and electric fields, because this device is Hetero Junction field effect

transistor with shottky barrier gate.