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MV04E050T050- bảng dữ liệu(PDF) 7 Page - List of Unclassifed Manufacturers |
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7 / 9 page Multilayer Chip Varistor for Surge and ESD Protection – E Type Series Document No TMVE-XXOS001C Issued date 2012/02/13 Page 7/9 TA-I TECHNOLOGY CO., LTD 8.5 IR reflow Pb Free Process suggestion profile (1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150µm (2) Ramp-up rate (217℃ to Peak) + 3℃/second max (3) Temp. maintain at 175 +/-25℃ 180 seconds max (4) Temp. maintain above 217℃ 60-150 seconds (5) Peak temperature range 245℃+20℃/-10℃ time within 5℃ of actually peak temperature (tp) 10~20 seconds (6) Ramp down rate +6 ℃/second max. ※ Perform adequate test in advance, as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace. 8.6 Resistance to soldering heat-High Temperature Resistance: 260℃,10sec-3times. 8.7 Hand Soldering In hand soldering of the Varistors. Large temperature gradient between preheated the Varistors and the tip of soldering iron may cause electrical failures and mechanical damages such as cracking or breakings of the devices. The soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering. 8.7.1 Recommended Soldering Condition 1 (1) Solder: 0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core. Rosin-based and non-activated flux is recommended. (2) Preheating: The Varistors shall be preheated so that Temperature Gradient between the devices and the tip of soldering iron is 150℃ or below. (3) Soldering Iron: Rated Power of 20w max with 3mm soldering tip in diameter. Temperature of soldering iron tip 380℃max,3-5sec ( The required amount of solder shall be melted in advance on the soldering tip.) (4) Cooling: After soldering. The Varistors shall be cooled gradually at room ambient temperature. |
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Mô tả tương tự - MV04E050T050- |
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