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8 / 9 page Multilayer Chip Varistor for Surge and ESD Protection – E Type Series Document No TMVE-XXOS001C Issued date 2012/02/13 Page 8/9 TA-I TECHNOLOGY CO., LTD 8.7.2 Recommended Soldering Condition 2(Without preheating) (1) Solder iron tip shall not directly touch to ceramic dielectrics. (2) Solder iron tip shall be fully preheated before soldering while soldering iron tip to the external electrode of Varistors. 8.8 Post Soldering Cleaning 8.8.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly have influences on the electrical characteristic and the reliability (such as humidity resistance) of the Varistors which have been mounted on the board. It shall be confirmed that the characteristic and the reliability of the devices are not affected by the applied cleaning conditions 8.8.2 When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards. Following conditions are recommended for preventing failures or damages of the devices due to the large vibration energy and the resonance caused by the ultrasonic waves. (1) Frequency 29MHz max (2) Radiated Power 20w/lithr max (3) Period 5minuets max 9. Storage condition of products 9.1 Storage Conditions: (1) Storage Temperature: -10℃~+40℃ (2) Relative humidity: ≦75%RH (3) Varistor must be kept away from sunlight and stored in a non-corrosive atmosphere. 9.2 Period of Storage: 1 year 10. ECN Engineering Change Notice: The customer will be informed with ECN if there is significant modification on the characteristics and materials described in Approval Sheet. |
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