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ADC78H90 bảng dữ liệu(PDF) 2 Page - Texas Instruments

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ADC78H90 bảng dữ liệu(HTML) 2 Page - Texas Instruments

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ADC78H90
SNAS227D – NOVEMBER 2003 – REVISED MARCH 2013
www.ti.com
PIN DESCRIPTIONS AND EQUIVALENT
PIN DESCRIPTIONS AND EQUIVALENT
CIRCUITS (continued)
CIRCUITS (continued)
Pin
Equivalent
Description
Pin
Equivalent
Description
Symbol
Symbol
No.
Circuit
No.
Circuit
Digital clock input. The range of
Positive analog supply pin. This
frequencies for this input is 50
pin should be connected to a
kHz to 8 MHz, with ensured
quiet +2.7V to +5.25V source
16
SCLK
performance at 8 MHz. This
and bypassed to GND with a 1
2
AVDD
clock directly controls the
µF tantalum capacitor and a 0.1
conversion and readout
µF ceramic monolithic capacitor
processes.
located within 1 cm of the
power pin.
Digital data output. The output
samples are clocked out of this
Positive digital supply pin. This
15
DOUT
pin on falling edges of the
pin should be connected to a
SCLK pin.
+2.7V to AVDD supply, and
13
DVDD
bypassed to GND with a 0.1 µF
Digital data input. The
ceramic monolithic capacitor
ADC78H90's Control Register
14
DIN
located within 1 cm of the
is loaded through this pin on
power pin.
rising edges of the SCLK pin.
The ground return for the
Chip select. On the falling edge
3
AGND
analog supply and signals.
of CS, a conversion process
1
CS
begins. Conversions continue
The ground return for the digital
12
DGND
as long as CS is held low.
supply and signals.
POWER SUPPLY
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
Analog Supply Voltage AVDD
−0.3V to 6.5V
Digital Supply Voltage DVDD
−0.3V to AVDD + 0.3V, max 6.5V
Voltage on Any Pin to GND
−0.3V to AVDD +0.3V
Input Current at Any Pin (3)
±10 mA
Package Input Current(3)
±20 mA
Power Dissipation at TA = 25°C
See (4)
ESD Susceptibility (5)
Human Body Model
2500V
Machine Model
250V
Soldering Temperature, Infrared,
10 seconds (6)
260°C
Junction Temperature
+150°C
Storage Temperature
−65°C to +150°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND or VIN >VA or VD), the current at that pin should be
limited to 10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies
with an input current of 10 mA to two.
(4)
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJmax − TA)/θJA. In the 16-pinTSSOP, θJA is 96°C/W, so PDMAX = 1,200mW at 25°C and 625 mW at the maximum
operating ambient temperature of85°C. Note that the power consumption of this device under normal operation is a maximum of 12 mW.
The values for maximum power dissipation listed above will be reached only when the ADC78H90 is operated in a severe fault condition
(e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such
conditions should always be avoided.
(5)
Human body model is 100 pF capacitor discharged through a 1.5 k
Ω resistor. Machine model is 220 pF discharged through ZERO ohms
(6)
See AN450, “Surface Mounting Methods and Their Effect on Product Reliability”, or the section entitled “Surface Mount” found in any
post 1986 Texas Instruments Linear Data Book, for other methods of soldering surface mount devices.
2
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Copyright © 2003–2013, Texas Instruments Incorporated
Product Folder Links: ADC78H90


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