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ADS1203IRGTTG4 bảng dữ liệu(PDF) 2 Page - Texas Instruments |
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ADS1203IRGTTG4 bảng dữ liệu(HTML) 2 Page - Texas Instruments |
2 / 34 page ADS1203 SBAS318C − JUNE 2004 − REVISED JANUARY 2008 www.ti.com 2 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS(1) over operating free-air temperature range unless otherwise noted ADS1203 UNIT Supply Voltage, AVDD to AGND or VDD to GND −0.3 to 6 V Supply Voltage, BVDD to BGND −0.3 to 6 V Analog Input Voltage with Respect to AGND or GND AGND − 0.3 to AVDD + 0.3 V Reference Input Voltage with Respect to AGND AGND − 0.3 to AVDD + 0.3 V Digital Input Voltage with Respect to BGND or GND BGND − 0.3 to BVDD + 0.3 V Ground Voltage Difference, AGND to BGND ±0.3 V Voltage Differences, BVDD to AGND −0.3 to 6 V Input Current to Any Pin Except Supply ±10 mA Power Dissipation See Dissipation Rating Table Operating Virtual Junction Temperature Range, TJ −40 to +150 °C Operating Free-Air Temperature Range, TA −40 to +125 °C Storage Temperature Range, TSTG −65 to +150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS PARAMETER MIN NOM MAX UNIT Supply Voltage, AVDD to AGND or VDD to GND 4.5 5 5.5 V Supply Voltage, BVDD to BGND Low-Voltage Levels 2.7 3.6 V Supply Voltage, BVDD to BGND 5V Logic Levels 4.5 5 5.5 V Reference Input Voltage 0.5 2.5 2.6 V Operating Common-Mode Signal 0 5 V Analog Inputs VIN+ − VIN− (TSSOP package) −250 +250 mV Analog Inputs VIN+ − VIN− (QFN package) −0.1 × REFIO +0.1 × REFIO V External Clock(1) 16 20 24 MHz Operating Junction Temperature Range, TJ −40 +150 °C (1) With reduced accuracy, clock can go from 1MHz up to 32MHz; see Typical Characteristic curves. DISSIPATION RATINGS PACKAGE TA ≤ +25°C POWER RATING DERATING FACTOR ABOVE TA = +25 °C(1) TA = +70 °C POWER RATING TA = +85 °C POWER RATING TA = +125 5C POWER RATING TSSOP-8 532mW 4.3mW/ °C 338mW 274mW 102mW QFN-16 2540mW 20.4mW/ °C 1622mW 1316mW 500mW (1) This is the inverse of the traditional junction-to-ambient thermal resistance (RqJA). Thermal resistances are not production tested and are for informational purposes only. |
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