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ADS1203IRGTTG4 bảng dữ liệu(PDF) 2 Page - Texas Instruments

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ADS1203
SBAS318C − JUNE 2004 − REVISED JANUARY 2008
www.ti.com
2
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum located at the end of
this data sheet, or see the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range unless otherwise noted
ADS1203
UNIT
Supply Voltage, AVDD to AGND or VDD to GND
−0.3 to 6
V
Supply Voltage, BVDD to BGND
−0.3 to 6
V
Analog Input Voltage with Respect to AGND or GND
AGND − 0.3 to AVDD + 0.3
V
Reference Input Voltage with Respect to AGND
AGND − 0.3 to AVDD + 0.3
V
Digital Input Voltage with Respect to BGND or GND
BGND − 0.3 to BVDD + 0.3
V
Ground Voltage Difference, AGND to BGND
±0.3
V
Voltage Differences, BVDD to AGND
−0.3 to 6
V
Input Current to Any Pin Except Supply
±10
mA
Power Dissipation
See Dissipation Rating Table
Operating Virtual Junction Temperature Range, TJ
−40 to +150
°C
Operating Free-Air Temperature Range, TA
−40 to +125
°C
Storage Temperature Range, TSTG
−65 to +150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
MIN
NOM
MAX
UNIT
Supply Voltage, AVDD to AGND or VDD to GND
4.5
5
5.5
V
Supply Voltage, BVDD to BGND
Low-Voltage Levels
2.7
3.6
V
Supply Voltage, BVDD to BGND
5V Logic Levels
4.5
5
5.5
V
Reference Input Voltage
0.5
2.5
2.6
V
Operating Common-Mode Signal
0
5
V
Analog Inputs
VIN+ − VIN− (TSSOP package)
−250
+250
mV
Analog Inputs
VIN+ − VIN− (QFN package)
−0.1
× REFIO
+0.1
× REFIO
V
External Clock(1)
16
20
24
MHz
Operating Junction Temperature Range, TJ
−40
+150
°C
(1) With reduced accuracy, clock can go from 1MHz up to 32MHz; see Typical Characteristic curves.
DISSIPATION RATINGS
PACKAGE
TA
≤ +25°C
POWER RATING
DERATING FACTOR
ABOVE TA = +25
°C(1)
TA = +70
°C
POWER RATING
TA = +85
°C
POWER RATING
TA = +125
5C
POWER RATING
TSSOP-8
532mW
4.3mW/
°C
338mW
274mW
102mW
QFN-16
2540mW
20.4mW/
°C
1622mW
1316mW
500mW
(1) This is the inverse of the traditional junction-to-ambient thermal resistance (RqJA). Thermal resistances are not production tested and are for
informational purposes only.


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