Not Recommended for New Designs

ADS8284

SLAS628A – MARCH 2009 – REVISED APRIL 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

CH(i) to AGND (both P and M inputs)

VEE–0.3

VCC + 0.3

V

VCC to VEE

-0.3

18

V

+VA to AGND

–0.3

7

V

+VBD to BDGND

–0.3

7

V

ADC control digital input voltage to GND

–0.3

(+VBD + 0.3)

V

ADC control digital output to GND

–0.3

(+VBD + 0.3)

V

Multiplexer control digital input voltage to GND

–0.3

(+VA + 0.3)

V

Power control digital input voltage to GND

–0.3

(+VCC + 0.3)

V

Operating temperature range

–40

85

°C

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–2

2

kV

Electrostatic discharge

Charged device model (CDM), per JEDEC specification

–500

500

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Analog Input at Multiplexer Inputs

CHxP, CHxM

0

V

Digital Supply Voltage

+VBD

2.7

3.3

5.25

V

Analog Supply Voltage

+VA

4.75

5

5.25

V

Positive Supply Voltage for OPA

VCC

4.75

5

7.5

V

Negative Supply Voltage for OPA

VEE

–7.5

–5

–3

V

6.4 Thermal Information

RCG

UNIT

64 PINS

Junction-to-ambient thermal resistance

24.0

Junction-to-case(top) thermal resistance

7.8

Junction-to-board thermal resistance

3.2

°C/W

Junction-to-top characterization parameter

0.1

Junction-to-board characterization parameter

3.2

Junction-to-case(bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6

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