ADS8509

SLAS324C – OCTOBER 2004 – REVISED APRIL 2010

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

MINIMUM

NO

MINIMUM

SPECIFICATION

RELATIVE

PACKAGE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

MISSING

SINAD

TEMPERATURE

ACCURACY

LEAD

DESIGNATOR

NUMBER

MEDIA, QTY

CODE

(dB)

RANGE

(LSB)

ADS8509IBDW

Tube, 25

SO-20

DW

ADS8509IBDWR

Tape and Reel, 2000

ADS8509IB

±2

16

85

–40°C to 85°C

ADS8509IBDB

Tube, 50

SSOP-28

DB

ADS8509IBDBR

Tape and Reel, 2000

ADS8509IDW

Tube, 25

SO-20

DW

ADS8509IDWR

Tape and Reel, 2000

ADS8509I

±3

15

83

–40°C to 85°C

ADS8509IDB

Tube, 50

SSOP-28

DB

ADS8509IDBR

Tape and Reel, 2000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder on www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

UNIT

±25 V

±25 V

Analog inputs

±25 V

REF

CAP

DGND, AGND2

±0.3 V

6 V

Ground voltage differences

0.3 V

6 V

Digital inputs

Maximum junction temperature

165°C

Storage temperature range

–65°C to 150°C

Internal power dissipation

700 mW

Lead temperature (soldering, 1.6 mm from case 10 seconds)

260°C

(1)

All voltage values are with respect to network ground terminal.

2

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